- Seen : 391 View
- established year : 2009
- Mobile : 008618320961328
- Phone : 008675526965124
- Fax : 008675526965242
- website : http://www.lvmay.com/
- E-mail : lv-market@lvmay.com
- Address : B3703 Famous Industrial Products Sourcing Center, 168 Bao Yuan Road, Bao'an District, Shenzhen, Guangdong, China
-
About us :
Shenzhen Lumei Jinyu Electronics Co., Ltd. was founded in 2009, is a professional production of double-sided, multi-layer high-precision circuit board and OEM, ODM integration enterprise. It has a production area of more than 50000 square meters, more than 2000 employees, and a monthly production capacity of 1.5 million square feet. The main products are high-precision through-hole boa ...
More -
About us :
Shenzhen Lumei Jinyu Electronics Co., Ltd. was founded in 2009, is a professional production of double-sided, multi-layer high-precision circuit board and OEM, ODM integration enterprise. It has a production area of more than 50000 square meters, more than 2000 employees, and a monthly production capacity of 1.5 million square feet. The main products are high-precision through-hole board, multilayer circuit board, flexible circuit board, rigid and flexible board and printed circuit board, while providing SMT support services to customers.
Close
Lvmay strives to be a win-win partner with customers, advocating quality first and providing customers with reliable one-stop connection solutions. Our products are widely used in military units, scientific research and development, quantum satellites, industrial control, medical equipment, aerospace, drones, unmanned vehicles, high-speed rail trains, new energy batteries, power electronics, automobile LED lights, security and other high-tech industries and provide customers with all aspects of product services, and have been unanimously recognized by many customers at home and abroad.
Our advantage
A. High speed: high speed and large capacity, large, high aspect ratio, high density backplane and system board, various back drilling processes, high speed simulation and testing capabilities, widely used in communication base stations, routers, switches, network communication equipment such as service / storage
B. RF microwave: mixed-pressure and local-mixed voltage, high-precision RF line control and various step nut processes, widely used in communication base stations, microwave communication and anti-collision radar auto-driving
C. Thermal Management: Metal-based and thick copper printed circuit board, multi-function integration, embedded power devices, ultra-strong copper processing technology, mainly used in communication base station repeaters, power modules, power devices, new energy vehicles, etc.
D. Miniaturization: One-stop miniaturization solution, high density HDI and package substrate area, SIP system-level packaging technology, multiple rigid-flexible cells, embedded active chips and passive devices, mainly used in industrial control, medical, aerospace and communication industries
