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CUPRUM Copper Cyanide Process 10
It is a cyanide bath characterized by its high velocity, deposition of copper layers with a bead surface, a smooth, fine-grained crystal structure.
SLOTOCUP TB 50 acidic copper process
The glossy copper process is based on sulfuric acid and provides an extremely high gloss coating with excellent launching power and excellent uniformity. The soft coating is also low in internal stress and has good corrosion resistance.
SLOTOCUP CU 50 Circuit Board Copper Process
It is a process used for plating copper on printed circuit boards, especially for use in the direct metallization phase. This process provides quick coating in the lower part of the holes and excellent throwing power. Also, the coating thickness distribution and metal finish are excellent. The resulting copper coating is fine, semi-glossy and flexible.
AGG single component gloss process 8
Glossy Copper Process ACG 8 Solution This process has an acidic and single-component environment and is therefore easy to work with. The gloss and uniformity of the copper coating resulting from this solution as well as the high deposition rate are characteristics of this process. Copper coatings have low internal tension, are flexible and soft and can be easily applied. Properly mechanized polishing of steel parts without any intermediate polishing operations can be achieved by plating nickel and chrome plating after copper plating.
It is worth noting that the ACG8 process is not sensitive to impurities and is also suitable for the deposition of thick copper for electrical forming.
There are also a variety of pulsed-flow copper plating processes.
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